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Electronic Components and Technology Conference, 1990. ., 40th

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1.Local CTE mismatch in SM leaded packages: a potential reliabilityconcern

机译：SM引线封装中的本地CTE不匹配：潜在的可靠性关心
- 作者：Clech J.-P.M.;Langerman F.M.;Augis J.A.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
2.The association of solderability testing with board level solderingperformance automatic optical inspection (AOI)

机译：可焊性测试与板级焊接的关联性能自动光学检查（AOI）
- 作者：Kwoka M.A.;Mullenix P.D.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
3.A comparison of copper and gold wire bonding on integrated circuitdevices

机译：集成电路上铜线和金线键合的比较设备
- 作者：Khoury S.L.;Burkhard D.J.;Galloway D.P.;Scharr T.A.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
4.The evolution of metallized film capacitors towards surfacemounting technology

机译：金属化薄膜电容器向表面的演变安装技术
- 作者：Fabbri C.;Bernardi A.;Malagoli G.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
5.Low temperature co-fired glass-ceramic, high-density-interconnect,substrate with improved thermal management

机译：低温共烧玻璃陶瓷，高密度互连，具有改善的热管理性能的基材
- 作者：Rich E.L. III;Martin A.J.;Lengel T.M.;Stewart J.J.;Gallo S.A.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
6.Analytical and experimental study for designing molding compoundsfor surface mounting devices

机译：设计模塑料的分析和实验研究用于表面安装设备
- 作者：Ohizumi S.;Ngasawa M.;Igarashi K.;Kohmoto M.;Ito S.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
7.Creep-fatigue modelling for solder-joint reliability predictionsincluding the microstructural evolution of the solder

机译：蠕变疲劳建模用于焊点可靠性预测包括焊料的微观结构演变
- 作者：Frost H.J.;Howard R.T.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
8.Effect of composition on the low-cycle fatigue of Pb alloy solderjoints

机译：组成对铅合金焊料低周疲劳的影响关节
- 作者：Guo Z.;Hacke P.;Sprecher A.F.;Conrad H.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
9.Multichip 1.8-Gb/s high-speed space-division switching module usingcopper-polyimide multilayer substrate

机译：使用以下功能的多芯片1.8 Gb / s高速空分交换模块聚酰亚胺铜多层基板
- 作者：Yamanaka N.;Kikuchi S.;Kon T.;Ohsaki T.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
10.Multichip thin-film technology for low temperature packaging CCDimage sensors

机译：用于低温封装的多芯片薄膜技术CCD图像传感器
- 作者：Chen C.-L.;Johnson R.W.;Jaeger R.C.;Cornelius M.B.;Foster W.A.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
11.Thermal stress/strain analysis of ceramic quad flat pack packagesand interconnections

机译：陶瓷方形扁平包装的热应力/应变分析和互连
- 作者：Lau J.H.;Rice D.W.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
12.Assessment of aqueous cleaning of PWAs with wave and reflowsoldered components

机译：用波和回流评估水净化PWA焊接元件
- 作者：Castelli G.;Specchiulli G.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
13.The performance and reliability of a new plated copper technologyon ceramic

机译：新型镀铜技术的性能和可靠性在陶瓷上
- 作者：Fudala J.;Beke M.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
14.A new high temperature multilayer capacitor with acrylatedielectrics

机译：一种新型的丙烯酸酯高温多层电容器电介质
- 作者：Yializis A.;Powers G.L.;Shaw D.G.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
15.A new power cycling technique for accelerated reliabilityevaluation of plated-through-holes and interconnects in PCBs

机译：一种新的功率循环技术，可提高可靠性评估PCB中的镀通孔和互连
- 作者：Munikoti R.;Dhar P.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
16.Effects of polymer/metal interaction in thin-film multichip moduleapplications

机译：聚合物/金属相互作用对薄膜多芯片模块的影响应用领域
- 作者：Adema G.M.;Turlik I.;Smith P.L.;Berry M.J.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
17.Acetylene-terminated polyimide oligomers as the interlayerdielectric for multilevel interconnects, some basic electricalcharacterizations

机译：乙炔封端的聚酰亚胺低聚物作为中间层用于多层互连的电介质，一些基本的电气表征
- 作者：Puglisi C.;McMahon J.;Winster A.;Rossi R.D.;Conners J.E.;Fuller L.F.;Hesler K.H.;Tourville S.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
18.Solder-glass attachment in Cerdip/Cerquad packages: thermallyinduced stresses and mechanical reliability

机译：Cerdip / Cerquad封装中的焊接玻璃附件：热感应应力和机械可靠性
- 作者：Suhir E.;Poborets B.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
19.Signal integrity analysis of high-speed, high-pin-count digitalpackages

机译：高速，高引脚数数字的信号完整性分析包装
- 作者：Tsai C.-T.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
20.Investigations of failure mechanisms of TAB-bonded chips duringthermal aging

机译：TAB键合芯片失效机理的研究热老化
- 作者：Zakel E.;Reichl H.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
21.Reliability assurance of laser-fiber coupling in an undersealightwave package

机译：海底激光光纤耦合的可靠性保证光波包装
- 作者：Ku R.T.;Burns M.J.;Dean B.A.;Eltringham T.F.;Nash F.R.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
22.Compatibility testing procedures and results for plastics andelastomers used with alternative cleaning agents

机译：塑料和塑料的相容性测试程序和结果与替代清洁剂一起使用的弹性体
- 作者：Yellow J.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
23.New military qualification testing procedures for cleaning agentalternatives to CFCs

机译：清洁剂的新军事资格测试程序氟氯化碳的替代品
- 作者：Smiley B.C.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
24.Physical design of the ODL-250H militarized surface mount opticaldata link

机译：ODL-250H军事表面贴装光学器件的物理设计数据链接
- 作者：Acarlar M.S.;Plourde J.K.;Steiner G.J.;Voitek M.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
25.A laser based system for tape automated bonding to integratedcircuits

机译：基于激光的系统，用于胶带自动粘合到集成电路
- 作者：Spletter P.J.;Crowley R.T.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
26.Extremely reliable bonding of large silicon dice using gold-tinalloy

机译：使用金锡极其可靠地粘接大型硅芯片合金
- 作者：Matijasevic G.S.;Wang C.Y.;Lee C.C.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
27.Engineering change (EC) technology for thin film metallurgy onpolyimide films

机译：用于薄膜冶金的工程更改（EC）技术聚酰亚胺薄膜
- 作者：Ray S.K.;Seshan K.;Interrante M.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
28.An aramid/epoxy substrates increased the facility of rigid-flexiblesubstrates for high performance use

机译：芳族聚酰胺/环氧树脂基材增加了刚柔结合的能力高性能基材
- 作者：Tsunashima E.;Okuno A.;Oyama N.;Hirakawa T.;Nishimura K.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
29.Design of HWSI multichip modules for quick prototyping andmanufacturing

机译：HWSI多芯片模块的设计，用于快速原型设计和制造业
- 作者：Lee Y.C.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
30.Plastic ICs for military equipment cost reduction challenge andfeasibility demonstration

机译：用于军事装备成本降低挑战的塑料IC和可行性论证
- 作者：Brizoux M.;Lerose S.;Chadebec G.;Potage J.;Miet J.M.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
31.Flip-chip solder bump fatigue life enhanced by polymerencapsulation

机译：聚合物提高了倒装芯片焊料凸点的疲劳寿命封装
- 作者：Suryanarayana D.;Hsiao R.;Gall T.P.;McCreary J.M.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
32.Comparison of predicted and measured lead stiffnesses of surfacemounted packages

机译：比较预测的和测量的表面引线刚度安装的包装
- 作者：Jahsman W.E.;Jain P.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
33.High performance screen-printable silicone as selective hybrid ICencapsulant

机译：高性能丝网印刷有机硅作为选择性混合IC密封剂
- 作者：Wong C.P.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
34.Field-induced instabilities in polyimide passivated lateral PNPtransistors

机译：聚酰亚胺钝化侧向PNP的场致不稳定性晶体管
- 作者：El-Kareh B.;Hook T.B.;Johnson M.E.;Lajza J.J.;McLaughlin R.W.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
35.Materials/processing approaches to phase stabilization of thermallyconductive pastes

机译：用于热相稳定的材料/处理方法导电胶
- 作者：Anderson H.R. Jr.;Booth R.B.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
36.Effect of board design and assembly process on leakage currents ofceramic chip capacitors

机译：电路板设计和组装工艺对漏电流的影响陶瓷片状电容器
- 作者：Chang D.D.;Anderson F.R.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
37.Silicones with improved thermal conductivity for thermal managementin electronic packaging

机译：有机硅具有改进的导热性，可用于热管理在电子包装中
- 作者：Peterson A.L.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
38.The impact of packaging on the reliability of flip chip solderbonded devices

机译：封装对倒装焊锡可靠性的影响绑定设备
- 作者：Lodge K.J.;Pedder D.J.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
39.Microstructural evolution during thermomechanical fatigue of 62Sn-36 Pb-2 Ag and 60 Sn-40 Pb solder joints

机译：62热机械疲劳过程中的微观组织演变Sn-36 Pb-2 Ag和60 Sn-40 Pb焊点
- 作者：Frear D.R.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
40.Thermal performance and reliability aspects of silicon hybridmulti-chip modules

机译：硅混合材料的热性能和可靠性方面多芯片模块
- 作者：Trigg A.D.;Corless A.R.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
41.Programmability concept of PGA package power and ground pinsapplicable to different gate array chip designs

机译：PGA封装电源和接地引脚的可编程性概念适用于不同的门阵列芯片设计
- 作者：Hoss P.-A.;Ghahghahi F.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
42.Preparation, structure, and fracture modes of Pb-Sn and Pb-Interminated flip chips attached to gold-capped microsockets

机译：Pb-Sn和Pb-In的制备，结构和断裂模式终止的倒装芯片连接到金封的微型插槽
- 作者：Puttlitz K.J.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
43.Prototype packages in aluminium nitride for high performanceelectronic systems

机译：氮化铝中的原型封装可实现高性能电子系统
- 作者：Lodge K.J.;Sparrow J.A.;Perry E.D.;Logan E.A.;Goosey M.T.;Pedder D.J.;Montgomery C.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
44.Self aligned, flip chip assembly of photonic devices withelectrical and optical connections

机译：自对准，光子器件的倒装芯片组装电气和光学连接
- 作者：Wale M.J.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
45.Prediction of temperature cycling life for SMT solder joints onTCE-mismatched substrates

机译：SMT焊点在温度循环寿命的预测TCE不匹配的底物
- 作者：Riemer D.E.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
46.Mechanical characteristics of 96.5 Sn/3.5 Ag solder inmicro-bonding

机译：96.5 Sn / 3.5 Ag焊料的机械特性微键
- 作者：Harada M.;Satoh R.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
47.Lead inductance of ferromagnetic materials and a method to reduceinductance at low frequencies

机译：铁磁材料的铅电感及其降低方法低频电感
- 作者：Huang C.C.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
48.Low-loss fusion splicing of erbium-doped optical fibers for highperformance fiber amplifiers

机译：高损耗掺-光纤的低损耗熔接高性能光纤放大器
- 作者：Singh M.P.;Reese J.O.;Wei T.;Storch D.G.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
49.Wideband characterization and modeling of TAB packages using timedomain techniques

机译：使用时间对TAB包进行宽带表征和建模领域技术
- 作者：Su W.;Riad S.M.;Poulin T.;Fett D.;Shen Z.-Y.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
50.Fatigue life prediction of solder material: effect of ramp time,hold time and temperature

机译：焊料的疲劳寿命预测：斜坡时间的影响，保持时间和温度
- 作者：Vaynman S.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
51.Corrosion of the joining metallurgy in multilayer substrates duringprocessing

机译：多层基板中接合冶金的腐蚀处理中
- 作者：Kumar A.H.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
52.Progression of damage caused by temperature cycling on a large diein a molded plastic package

机译：大芯片上温度循环导致的损坏进展在模压塑料包装中
- 作者：Lesk I.A.;Thomas R.E.;Hawkins G.;Remmel T.P.;Rugg J.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
53.A high performance electrical and optical interconnectiontechnology

机译：高性能的电气和光学互连技术
- 作者：Ryckebusch M.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
54.A stable laser module with UV-curable resin for single-modesubscriber use

机译：具有紫外线固化树脂的稳定激光模块，用于单模订户使用
- 作者：Suzuki M.;Nakanishi T.;Tsuzuki N.;Murata N.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
55.Development of a new air-cooling heatsink for a high densitycomputer system

机译：开发高密度的新型空气冷却散热器电脑系统
- 作者：Takada J.;Kimura Y.;Ogushi T.;Fujii M.;Kohara M.;Nakao S.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
56.Reliability of infrared surface light emitting diodes suitable formilitary and avionic wavelength division multiplexing systems

机译：适用于红外表面发光二极管的可靠性军事和航空波分复用系统
- 作者：Lindsay C.E.;Conlon R.F.B.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
57.Development of low elastic modulus die attach material and cleancure process

机译：低弹性模量贴片材料的开发和清洁固化过程
- 作者：Suzuki K.;Higashino T.;Tsubosaki K.;Mine K.;Nakayoshi K.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
58.Unique polybutadiene resin-characteristics after hardening andapplication to IC

机译：硬化和固化后具有独特的聚丁二烯树脂特性应用于IC
- 作者：Battisti A.;Hirayama K.;Okuno A.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
59.Relation between inner voids of plastic IC packages andnon-Newtonian flow characteristics of resin encapsulant

机译：塑料IC封装内部空隙与树脂密封剂的非牛顿流动特性
- 作者：Ichimura S.;Kinashi K.;Urano T.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
60.Parylene encapsulation of ceramic packages for liquid nitrogenapplication

机译：用于液氮的陶瓷封装的聚对二甲苯封装应用
- 作者：Tong H.M.;Mok L.;Grebe K.R.;Yeh H.L.;Srivastava K.K.;Coffin J.T.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
61.Effect of combination between various polyimide coating materialsand molding compounds on the reliability of integrated circuits (ICs)

机译：各种聚酰亚胺涂料的组合效果和模塑料对集成电路（IC）的可靠性
- 作者：Takeuchi E.;Takeda T.;Hirano T.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
62.Relation between delamination and temperature-cycling inducedfailures in plastic packaged devices

机译：分层与诱导的温度循环之间的关系塑料包装设备的故障
- 作者：van Doorselaer K.;de Zeeuw K.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
63.Technology developments for terpene cleaning of electronicassemblies

机译：电子萜烯清洁技术的发展组件
- 作者：Tashjian G.P.;Wenger G.M.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
64.Parametric shifts in devices: role of packaging variables and somenovel solutions

机译：设备中的参数转换：包装变量的作用和一些新颖的解决方案
- 作者：Pendse R.;Jennings D.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
65.Strength and reliability of ceramic modules soldered to flexiblecables

机译：焊接到柔性板上的陶瓷模块的强度和可靠性电缆线
- 作者：Panousis N.T.;Prosser J.F.;Wang A.T.;Yong Y.N.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
66.Mechanism of electro-migration in ceramic package induced bychip-coating polyimide

机译：陶瓷封装引起的电迁移机理芯片涂层聚酰亚胺
- 作者：Kohara M.;Mashiko Y.;Nakazaki K.;Nunoshita M.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
67.Structural effect of IC plastic package on residual stress insilicon chips

机译：IC塑料封装对残余应力的结构影响硅芯片
- 作者：Miura H.;Nishimura A.;Kawai S.;Murakami G.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
68.Fabricatiofn and characterization or iridium silicide/siliconSchottky barrier

机译：制备和表征或硅化铱/硅肖特基势垒
- 作者：Hao J.H.;Zhao X.R.;Qiou S.C.;Yi X.J.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
69.Materials of BaO-SnO₂-Sb₂O₃ systemof ceramic fixed resistors

机译：BaO-SnO _{2 -Sb _{2 O _{3 系统的材料陶瓷固定电阻器}}}
- 作者：Zhuang Yan;Yang Zunde;Yu Zhengfang;Zheng Yufang;Zhang D.H.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
70.YBa₂Cu₃O_6-x-based thick filmresistor

机译：YBa _{2 Cu _{3 O _{6-x 基厚膜电阻器}}}
- 作者：Fu Shen-Li;Hsieh Y.H.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
71.Damage in silicon caused by magnetron ion etching and its recoveryeffect

机译：磁控离子蚀刻引起的硅损伤及其恢复影响
- 作者：Hirai M.;Iwakuro H.;Ohno J.-I.;Kuroda T.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
72.Multiphase imide block copolymers: new materials formicroelectronics applications

机译：多相酰亚胺嵌段共聚物：用于微电子应用
- 作者：Labadie J.W.;Hedrick J.L.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
73.Power and ground plane inductance for single-chip package

机译：电源和接地层电感用于单芯片封装
- 作者：Murphy A.T.;Young F.J.;Poulin T.R.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
74.Analysis and simulation of multiconductor transmission lines forhigh-speed interconnect and package design

机译：车用多导体传输线的分析与仿真。高速互连和封装设计
- 作者：You H.;Soma M.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
75.Grain boundary sliding in surface mount solders during thermalcycling

机译：热过程中表面安装焊料的晶界滑动循环
- 作者：Lee S.-M.;Stone D.S.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
76.Capacitance: relationships and measurements for multipleconductors in VLSI packages and PWB

机译：电容：关系和度量用于多个VLSI封装和PWB中的导体
- 作者：Canright R.E. Jr.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
77.Progress by the electronics industry on protection of stratosphericozone

机译：电子工业在平流层保护方面的进展臭氧
- 作者：Andersen S.O.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
78.Development of ultra-thin surface mounting IC package (0.8 mm thickTQFP)

机译：开发超薄型表面贴装IC封装（0.8毫米厚）TQFP）
- 作者：Fujita K.;Oomi S.;Toyozawa K.;Minamide S.;Maeda T.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
79.Area-distributed-soldering of flexible and rigid printed circuitboards

机译：柔性和刚性印刷电路的面积分布焊接木板
- 作者：Clark W.A.;Pelosi W.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》
80.Equivalent series resistance-the fourth parameter for tantalumcapacitors

机译：等效串联电阻-钽的第四个参数电容器
- 作者：Stroud J.P.
- 会议名称：《Electronic Components and Technology Conference, 1990. ., 40th》