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Imprint technology: A potential low-cost solution for sub-45nm device applications

机译:压印技术:子45nm设备应用的潜在低成本解决方案

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Nano-imprint technology has demonstrated the potential for a low-cost, high-throughput Next Generation Lithography (NGL) method extendable to ultra-fine geometry requirements. Although the development of nano-imprinting lithography has been focused on semiconductor applications, the technology could provide a pathway for non-semiconductor-related applications as well. Examples of technologies that may benefit from this nano-imprint are high-density drives and other stand-alone memories, organic and flexible electronics, photonics, nanoelectronics, biotechnology, etc. With the rapid advances in these industries, the need for sub-nanometer features to drive performance and innovation, while maintaining cost, is to be expected. Step and Flash Imprint Lithography (S-FILTM) is one of several cost-effective imprinting technologies being pursued for sub-100 nm resolution. In demonstrating successful final pattern transfer of features less than 45 nm, S-FIL has sparked some interest as a viable alternative to other NGL methods. Unlike optical-based lithography, imprint utilizes the basic concept of contact printing, and therefore, does not require expensive optics and complex resist material to create images. Thus, the cost of ownership for nano-imprint lithography compared with other optical-based NLGs could provide solutions for many applications. Improvements made in S-FIL in the areas of material dispensing and refinement of the etch barrier (EB) have resulted in more uniform printing while producing a thinner residual layer. These improvements, coupled with changes to the etch processes have enabled pattern transfer with minimal critical dimension (CD) loss. This paper will describe both the new imprinting results and pattern transfer to demonstrate sub-45nm features. CD bias at each of the process steps will also be discussed. Examples of sub-45 nm (1:3) line/space features post imprint and final pattern transfer into oxide will be shown.
机译:纳米压印技术已经证明了一个低成本,高通量的下一代光刻(NGL)方法扩展到超精细的几何形状要求的潜力。虽然纳米压印光刻的发展一直专注于半导体应用,该技术可以用于非半导体相关应用提供了一个途径为好。可以从该纳米压印受益的技术的例子是高密度驱动器和其他独立的回忆,有机和柔性电子,光电子,纳米电子学,生物技术等,随着这些行业的快速发展,需要亚纳米功能来驱动器性能和创新,同时保持成本,是可以预料的。步骤和Flash压印光刻(S-FILTM)是所追求用于亚100nm的分辨率几个成本效益压印技术之一。在证明的特征成功最终图案转印小于45纳米,S-FIL已经引发了一些兴趣作为一种可行的替代其他NGL方法。不像基于光学的光刻,压印利用接触印刷的基本概念,并且因此,不需要昂贵的光学元件和复杂的抗蚀剂材料来创建图像。因此,与其他基于光学的NLGS相比,拥有纳米压印光刻成本可能对于许多应用提供解决方案。在S-FIL在材料的分配和所述蚀刻阻挡(EB)的精细化方面取得改进,同时产生一个较薄的残留层导致更均匀的印刷。这些改进,加上更改蚀刻工艺已启用与最小临界尺寸(CD)的损失的图案转移。本文将描述这两种新的印迹结果和模式转移到演示子45纳米功能。在每个过程的步骤CD偏差也将被讨论。子45纳米(1:3)的实例线条/空间设有交印记和最终图案转移到氧化物将被显示。

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