首页> 外文会议>Integrated Reliability Workshop Final Report, 2000 IEEE International >Plasma-induced-damage (PID) free 29A nitrided gate oxide of 130 nm CMOS devices for high performance microprocessor manufacturing
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Plasma-induced-damage (PID) free 29A nitrided gate oxide of 130 nm CMOS devices for high performance microprocessor manufacturing

机译:适用于高性能微处理器制造的130 nm CMOS器件的无等离子体诱导损伤(PID)的29A氮化栅氧化物

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This paper presents how root causes of PID to 29A Gate Oxide (Gox) in 130 nm CMOS devices for high performance /spl mu/P application were identified. Two types of failures of Gox capacitors (CAPs) were observed. One appeared as shorts of CAPs (Mode-A), while the other one creates a small distribution of lower breakdown field (Mode-B) of Gox CAPs. Through extensive experiments, these two types of failures were related to PID of two separate processing tools.
机译:本文鉴定了针对高性能/ SPL MU / P应用的130nm CMOS器件中PID到29A栅极氧化物(GOX)的根本原因。观察到GOX电容器(盖子)的两种类型的故障。一个人出现在帽子短的短缺(模式-A),而另一个则创建了Gox帽的较低击穿字段(Mode-B)的小分布。通过广泛的实验,这两种类型的故障与两个单独的处理工具的PID有关。

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