Realization of buried passive components in low-temperature co-fired ceramic materials by thick-film techniques

摘要

In this article the manufacturing of buried passive components in low-temperature co-fired ceramic (LTCC) materials for radio frequencies is considered. Planar cols and capacitors were printed by gravure-offset printing and screen printing. The narrowest conductor lines were about 75 #mu#m wide. All components consisted of a few conductor layers. Small via holes between the layers were made by a laser and the holes were filled by screen printing. The effects of the geometrical parameters of the inductors and capacitors on their electrical values and tolerances were studied by