Post-processing of conductive lithographic films for multilayer device fabrication

摘要

Cheap, flexible conductive interconnects have the potential for application to a wide variety of device structures. Conductive lithography is a very fast single-stage printing process for flexible electrical interconnects. For the more challenging exploitation areas in multilayer devices, such as displays, it was found that the existing films could not be employed in their current form and three parameters were identified as critical to device fabrication. Two distinct methods of post-processing have been investigated, calendering and electroless plating, to improve properties. Both methods aimed to modify the surface roughness and conductivity, with the plating study also modifying the work function. We report the successful evaluation of polymer light-emitting diodes fabricated using these electrode structures and compare their properties. It is expected that these developments will stimulate further progress in multilayer device fabrication.