Study of wafer cleaning process safety using Inherently Safer Design Strategies

摘要

The wafer process disasters is to use inherently safer design (ISD) strategies to take full account of the manufacturing plant is built to eliminate hazards of energy source; disasters and accidents must be greatly reduced. This study used concept of substituted wet bench chemicals from N-396 to replace to DSP. The experimental results due to the 11 batches and replaced of 10nm wafer process, the product yield increased to 85.36% from 83.75%, improvement of electrical characteristics DC (%) from 6.37% to 6.44, improvement of frequency response (%) from 5.27% down to 4.30%, improvement of stripping ability (%) from 4.47% to 4.20%.