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Splendidly blended: a machine learning set up for CDU control

机译:精彩融合:用于CDU控制的机器学习设置

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As the concepts of machine learning and artificial intelligence continue to grow in importance in the context of internet related applications it is still in its infancy when it comes to process control within the semiconductor industry. Especially the branch of mask manufacturing presents a challenge to the concepts of machine learning since the business process intrinsically induces pronounced product variability on the background of small plate numbers. In this paper we present the architectural set up of a machine learning algorithm which successfully deals with the demands and pitfalls of mask manufacturing. A detailed motivation of this basic set up followed by an analysis of its statistical properties is given. The machine learning set up for mask manufacturing involves two learning steps: an initial step which identifies and classifies the basic global CD patterns of a process. These results form the basis for the extraction of an optimized training set via balanced sampling. A second learning step uses this training set to obtain the local as well as global CD relationships induced by the manufacturing process. Using two production motivated examples we show how this approach is flexible and powerful enough to deal with the exacting demands of mask manufacturing. In one example we show how dedicated covariates can be used in conjunction with increased spatial resolution of the CD map model in order to deal with pathological CD effects at the mask boundary. The other example shows how the model set up enables strategies for dealing tool specific CD signature differences. In this case the balanced sampling enables a process control scheme which allows usage of the full tool park within the specified tight tolerance budget. Overall, this paper shows that the current rapid developments off the machine learning algorithms can be successfully used within the context of semiconductor manufacturing.
机译:随着机器学习和人工智能概念在与互联网相关的应用程序中的重要性不断提高,在半导体工业中进行过程控制时仍处于起步阶段。尤其是掩模制造部门对机器学习的概念提出了挑战,因为在小板数的背景下,业务流程本质上会引起明显的产品可变性。在本文中,我们介绍了机器学习算法的体系结构设置,该算法成功处理了掩模制造的要求和陷阱。给出了此基本设置的详细动机,然后对其统计属性进行了分析。用于掩膜制造的机器学习设置涉及两个学习步骤:初始步骤,用于识别和分类过程的基本全局CD模式。这些结果构成了通过平衡采样提取优化训练集的基础。第二个学习步骤是使用此训练集来获取由制造过程引起的局部和全局CD关系。通过两个以生产为动机的示例,我们展示了这种方法如何灵活,强大,足以应付掩模制造的严格要求。在一个示例中,我们显示了如何将专用协变量与CD映射模型的提高的空间分辨率结合使用,以处理蒙版边界处的病理CD效应。另一个示例显示了模型设置如何启用用于处理特定于工具的CD签名差异的策略。在这种情况下,平衡采样启用了过程控制方案,该方案允许在指定的严格公差预算内使用完整的刀具库。总体而言,本文表明,机器学习算法的当前快速发展可以在半导体制造的背景下成功使用。

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