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Effect of lead frame design and thickness of Dual Row Quad Flat No Lead Package (DR-QFN)

机译:引线框架设计和双排四方扁平无铅封装(DR-QFN)的厚度的影响

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This study presents the thermo-mechanical stress characteristic of the Dual Row Quad Flat No Lead (DR-QFN) of a 44 lead DR-QFN package with staggered lead frame design and 48 lead DR-QFN package with inline lead frame design. The steady-state structural analysis for DR-QFN package with different lead frame design is performed using ANSYS software. The stress behavior of DR-QFN package with different lead frame thickness also been presented in this study. The 3D models used in this study were developed using finite element method with SOLID 70 and MESH 200 element types. From the study, results show that thinner lead frame gives smaller value of stress. DR-QFN package with lead frame thickness of 0.15 mm has 6% smaller value of stress compared to package with lead frame thickness of 0.20 mm. For lead frame configuration analysis in the DR-QFN package, both staggered and inline lead frame design, show no significant differences in terms of displacement and stress value. As a conclusion the stress can be reduced by using thinner lead frame.
机译:这项研究提出了具有交错引线框架设计的44引线DR-QFN封装和具有串联引线框架设计的48引线DR-QFN封装的双行四方扁平无引线(DR-QFN)的热机械应力特性。使用ANSYS软件对具有不同引线框架设计的DR-QFN封装进行稳态结构分析。这项研究还提出了不同引线框架厚度的DR-QFN封装的应力行为。本研究中使用的3D模型是使用SOLID 70和MESH 200元素类型的有限元方法开发的。根据研究,结果表明,引线框架越薄,应力值越小。与引线框厚度为0.20 mm的封装相比,引线框厚度为0.15 mm的DR-QFN封装的应力值小6%。对于DR-QFN封装中的引线框架配置分析,交错和直插式引线框架设计在位移和应力值方面均未显示出显着差异。结论是,通过使用更薄的引线框架可以减少应力。

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