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LEAD FRAME STRUCTURE FOR QUAD FLAT NO-LEAD PACKAGE, QUAD FLAT NO-LEAD PACKAGE AND METHOD FOR FORMING THE LEAD FRAME STRUCTURE
LEAD FRAME STRUCTURE FOR QUAD FLAT NO-LEAD PACKAGE, QUAD FLAT NO-LEAD PACKAGE AND METHOD FOR FORMING THE LEAD FRAME STRUCTURE
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机译:四平无铅包装的铅框架结构,四平无铅包装和铅框架结构的形成方法
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摘要
A lead frame structure for quad flat no-lead (QFN) package includes a main base, a plurality of terminals and a first metal layer. The main base has a center area for carrying a semiconductor die, and a periphery area surrounding the center area. The plurality of terminals are arranged around the main base. The first metal layer has a first part formed on the periphery area of the main base, and a second part formed on the plurality of terminals. Wherein the main base and the plurality of terminals are formed by a stamping process, and the first metal layer is formed by a plating process before the stamping process.
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