Optimizing Inspection Recipe by using Virtual Inspector Virtual Analyzer and Failure Bitmap

摘要

This paper presents a novel systematic methodology to identify yield limiting killer defects by using KLA-Tencor's wafer inspection tools, Klarity Bitmap software and VIVA (Virtual Inspector Virtual Analyzer). This methodology covers two approaches: optimize inspection recipe through short-loop wafers from ADI (After-Develop Inspection) to AEI (After-Etch Inspection); re-optimize inspection recipe by using bitmap failures from Klarity Bitmap as hot spots to VIVA. The results of this study demonstrated that the chipmakers can potentially shorten the learning cycle for identifying killer defects by using this method.