Failure Analysis of Via with Solder Bubble

摘要

Lead-free soldering in PCB (printed circuit board) has targeted the elimination of Pb usage in electronic assemblies for the inherent toxicity and requires high soldering temperature, resulting in the problems about quality and reliability of PCB performance during assembly process. Also the high temperature may challenge the thermal performance of PCB materials. And the defects of electrical components, PCB soldering-pad, solder and flux materials, manufacturing process and other donkey materials may induce the failure problems of PCB. In the paper, one failure PCBA (Printed Circuit Board Assembly) sample were studied compared with the bare PCB sample. Abnormity solder bubbles of failure PCBA were inspected with the aid of stereomicroscope. The barrel plating and dialectical material in vias were separately analyzed by cross section between Failure PCBA Sample and Bare PCB Sample.