Optimising Rheology for Package-on-Package Flux Dip Processes

摘要

The transition of package on package assembly from the component manufacturers to the PCB assemblers has added a new layer of complexity for assembly process engineers. The cost and complexity of reworking the PoP construction is so significant such that the main aim for any NPI engineer is to introduce the most robust process, whilst ensuring that throughput requirements are met. As the process becomes more widespread both materials and equipment manufacturers continue to develop their products to deliver the production solutions which support our continual quest to miniaturise electronics.