THE INVESTIGATION OF WARPAGE BEHAVIOR BY CONSIDERING THE PROCESS-INDUCED PROPERTY VARIATION IN SEQUENTIAL OVERMOLDING

摘要

The crucial factors in multi-component molding (MCM) processes were difficult to identify with the conventional trial-and-error method due to its complicated nature and physical mechanism. Regarding the temperate conduction effect between two shots, we adopt directly a true 3D simulation tool to investigate. The part temperature distribution of the first shot is taken into consideration and affects the mold filling pattern of the second shot. Besides, the mechanical property of the first shot will also influence the warpage and shrinkage behavior of the second shot and the final product. Simulations can provide good guidelines to help people understand the mechanism and make the proper design to fabricate modern MCM products.