Edge Enhancement for Acoustic Microscopy of Flip Chip Devices

摘要

Alteration in the standard Scanning Acoustic Microscopy parameters, the gain and TOF, enable detection of die edge cracks in assembled Flip Chip devices. IR imaging after thinning and polishing of the die confirms the die edge cracks. The SAM analysis can now replace the IR imaging for detection of small die edge cracks taking minutes to complete instead of the hours involved in the sample preparation for IR imaging.