首页> 外文会议>Eco-Materials Processing and Design VIII; Materials Science Forum; vols.544-545 >Study on Indium Tin Oxide Films Deposited Using Different Conductive ITO Targets by DC Magnetron Sputtering
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Study on Indium Tin Oxide Films Deposited Using Different Conductive ITO Targets by DC Magnetron Sputtering

机译:直流磁控溅射法研究不同导电ITO靶沉积的氧化铟锡薄膜

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摘要

Indium Tin Oxide (ITO) films were deposited on nonalkali glass substrate by dc magnetron sputtering using high density ITO targets with different conductivitis. Depositions were carried out at total gas pressure (P_(tot)) of 0.6 Pa, substrate temperature (T_s) of RT, oxygen flow ratio [O_2/(O_2+Ar)] of 0 ~ 3.0 % and dc power of 100W. High conductivity target showed relatively high stability in electrical property with increasing target erosion ratio. Optimum O_2 addition ratio to obtain the lowest resistivity was decreased with increasing target erosion ratio. High conductivity ITO target could lead to decrease in micro-nodule formation on the target surface because of high cooling. The decrease in resistivity was observed for the film annealed at H_2 introduction or without O_2 addition in vacuum, where could be attributed to increase in carrier density.
机译:使用具有不同电导率的高密度ITO靶,通过直流磁控溅射在无碱玻璃基板上沉积氧化铟锡(ITO)膜。在0.6 Pa的总气压(P_(tot)),RT的基板温度(T_s),氧气流量比[O_2 /(O_2 + Ar)]为0〜3.0%且直流功率为100W的条件下进行沉积。高电导率的靶材表现出相对较高的电性能稳定性,且靶材的腐蚀率增加。随着目标侵蚀率的增加,获得最低电阻率的最佳O_2添加率降低。高电导率的ITO靶可能会由于高冷却而导致靶表面微结节的形成减少。观察到在引入H_2或在真空中不添加O_2时退火的薄膜的电阻率降低,这可能归因于载流子密度的增加。

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