首页> 外文会议>International Conference on Nitride Semiconductors(ICNS-5); 20030525-20030530; Nara; JP >Growth of Al_xGa_(1-x)N and GaN on photo-electrochemically patterned SiC substrates
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Growth of Al_xGa_(1-x)N and GaN on photo-electrochemically patterned SiC substrates

机译:在光电化学图案化的SiC衬底上生长Al_xGa_(1-x)N和GaN

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The large defect densities in heteroepitaxially grown group-Ⅲ-nitride layers on sapphire or SiC cannot be tolerated in applications such as lasers. As an alternative to the well known ELOG process for defect reduction we report here on overgrowth of patterned 6H-SiC(0001) surfaces. First, we formed mesa structures in the windows of metal masks and then after removal of the masks layers of Al_xGa_(1-x)N and GaN were grown by low-pressure MOVPE under conditions of high lateral growth rates. We demonstrate that layers and layered structures can be grown with smooth surfaces and reduced defect densities (a factor 5-10 lower compared to growth on planar substrates). For a further reduction of defect densities a detailed understanding of the growth process on patterned substrates is necessary. Growth starts at the sidewalls of the mesa. For a defect reduction low pressures and high Ⅴ/Ⅲ-ratios are required. Very high lateral-to-vertical growth rates of more than 8 can be achieved on such structures.
机译:在激光等应用中,蓝宝石或SiC上异质外延生长的Ⅲ族氮化物层中的大缺陷密度是不能容忍的。作为减少缺陷的众所周知的ELOG工艺的替代方法,我们在此报告6H-SiC(0001)图案表面的过度生长。首先,我们在金属掩模的窗口中形成台面结构,然后在去除掩模后,在高横向生长速率的条件下,通过低压MOVPE来生长Al_xGa_(1-x)N和GaN层。我们证明了层和分层结构可以生长具有光滑的表面和降低的缺陷密度(与在平面基板上生长相比降低5-10倍)。为了进一步降低缺陷密度,需要对图案化衬底上的生长过程有详细的了解。生长从台面的侧壁开始。为了减少缺陷,需要低压和高Ⅴ/Ⅲ比。在这样的结构上可以实现超过8的非常高的横向到纵向增长率。

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