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Accumulation-mode high voltage SOI LDMOS with ultralow specific on-resistance

机译:具有超低比导通电阻的累积模式高压SOI LDMOS

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A high breakdown voltage (BV) thin SOI LDMOS with ultralow specific on-resistance is proposed and its mechanism is investigated. The LDMOS features an accumulation-mode extended gate (AEG) structure on the surface that consists of a P- region and two diodes in series. In the on-state, an electron accumulation layer is formed at the drift region surface and provides an ultralow resistance current path, which dramatically decreases the specific on-resistance (R) and obtains a very low and even-distributed temperature. In the off-state, the P- region in AEG depletes the N-drift region, and hence increases the drift doping concentration (N) and further decreases the R. Moreover, the two reverse biased diodes sustain the gate to drain voltage in the on-state and offstate respectively, ensuring a high breakdown voltage and low leakage current. Compared with a conventional thin SOI LDMOS, the proposed device reduces the R by 70% and increases the BV by 7%.
机译:提出了一种具有超低导通电阻的高击穿电压(BV)薄SOI LDMOS,并研究了其机理。 LDMOS在表面上具有累积模式扩展栅极(AEG)结构,该结构由一个P区和两个串联的二极管组成。在导通状态下,电子累积层形成在漂移区表面并提供超低电阻电流路径,从而大大降低了比导通电阻(R)并获得了非常低且均匀的温度。在截止状态下,AEG中的P-区域耗尽了N-漂移区域,因此增加了漂移掺杂浓度(N)并进一步降低了R。此外,两个反向偏置的二极管维持栅极的漏极漏极电压。导通状态和关断状态,确保高击穿电压和低泄漏电流。与传统的薄SOI LDMOS相比,该器件将R降低了70%,将BV提高了7%。

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