PFC EMISSIONS REDUCTION AND PROCESS IMPROVEMENTS WITH REMOTE PLASMA CVD CHAMBER CLEANS

摘要

For the past several years, the semiconductor industry has been striving to reduce emissions of perfluorocompounds (PFCs) as they are suspected global warming agents. Working with tool and chemical suppliers, semiconductor companies have been investigating technologies to reduce PFC emissions from CVD chamber cleaning and etch processes. Remote plasma chamber cleaning using NF_3 has been demonstrated to reduce PFC emissions from chamber clean processes by 95% or greater. In addition to PFC emissions reduction, remote plasma cleans have provided process improvements, such as reduced clean time, improved film uniformity, and reduced particle generation. By implementing NF_3-based chamber cleans, a modern 200 mm fab can likely achieve emissions reduction goals.