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Schottky-barrier modificationof low-energy Ar-ion bombarded GaAs and Si

机译:低能Ar离子轰击GaAs和Si的肖特基势垒修饰

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Epitaxially grown GaAs (p- and n-type) and n-Si were bombarded with low energy Ar-ions. Current voltage measurements on Schottky barrier diodes fabricated on the sputtered p-GaAs (Sc) and n-Si (Pd) showed that the series resistance and ideality factor were increased as the Ar-ion dose was increased. The respective increase and decrease in barrier heights of Sc/p-GaAs and Pd-Si diodes were attributed to the presence of donor-type surface states in the bombarded material. The barrier heights of Au Schottky diodes made on n-GaAs changed nonmonotonically with Ar-ion sputter voltage. Variations of barrier height in the 0-1 kV range were explained by the introduction of donor-type defects. We demonstrated that the introduction of high concentrations of continuous level defects above 1 kV resulted in Fermi level pinning to become the dominant mechanism for controlling the effective barrier of current transport. Our results have shown that Schottky barrier properties could be changed by controlled amounts by varying the bombarding ion dose or sputter voltage.
机译:用低能Ar离子轰击外延生长的GaAs(p型和n型)和n-Si。在溅射的p-GaAs(Sc)和n-Si(Pd)上制造的肖特基势垒二极管上的电流电压测量结果表明,随着Ar离子剂量的增加,串联电阻和理想因子也随之增加。 Sc / p-GaAs和Pd / n-Si二极管势垒高度的分别增加和减少归因于轰击材料中存在施主型表面态。在n-GaAs上制造的Au肖特基二极管的势垒高度随Ar离子溅射电压而非单调变化。通过引入施主型缺陷可以解释0-1 kV范围内势垒高度的变化。我们证明,引入1 kV以上高浓度连续能级缺陷导致费米能级钉扎成为控制电流传输有效屏障的主要机制。我们的结果表明,通过改变轰击离子剂量或溅射电压,可以通过控制量来改变肖特基势垒性能。

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