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Field-induced cathodic oxidation of low-energy Ar-ion-bombarded silicon by AFM

机译:AFM对低能Ar离子轰击硅的场致阴极氧化

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Local oxidation by atomic force microscopy (AFM) was studied on a 3 keV Argon (Ar)-ion-bombarded silicon (Si) (100) substrate. Giant oxide features higher than 100 nm were patterned by applying positive voltages to the tip with respect to the substrate. To analyze the growth rate of oxide features, we used the power-of-time law model. The growth rate of oxide features on an Ar-ion beam-bombarded silicon surface was increased approximately 1.8-fold compared to a common silicon surface. Furthermore, we obtained that the heights of oxide features increased as the exposure time to the tip decreased and the scan area increased.
机译:通过原子力显微镜(AFM)在3 keV氩离子(Ar)离子轰击的硅(Si)(100)衬底上研究了局部氧化。通过向相对于基板的尖端施加正电压来图案化高于100 nm的巨型氧化物特征。为了分析氧化物特征的增长率,我们使用了时间幂定律模型。与普通硅表面相比,在Ar离子束轰击的硅表面上氧化物特征的生长速率提高了约1.8倍。此外,我们发现随着尖端暴露时间的减少和扫描面积的增加,氧化物特征的高度也会增加。

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