Iinstitute of Microelectronics, A*STAR, 11 Science Park Road, Singapore Science Park II, Singapore 117685;
Department of Electrical and Computer Engineering, National University of Singapore, 4 Engineering Drive 3, Singapore 117576;
MEMS; scanning micromirror; wafer level packaging; low temperature wafer bonding; indium;
机译:在晶片级上验证超过600扫描MEMS微镜的自发参数下变频的临界点
机译:用硅晶片上用硅制成的电磁致动双轴扫描微镜
机译:扫描通过SOI / SOI晶圆键合工艺制造的微镜
机译:晶圆级封装扫描微镜的开发
机译:一种新颖的三维晶圆级芯片级封装技术-制造工艺开发和可靠性表征。
机译:扇出晶圆和面板级包装作为异构集成的包装平台
机译:开发树脂应力缓冲层型晶片型芯片尺寸封装,具有高可靠性的板级测试