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Wafer level package, wafer level packaging procedure for making wafer level package
Wafer level package, wafer level packaging procedure for making wafer level package
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机译:晶圆级封装,用于制造晶圆级封装的晶圆级封装程序
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摘要
A wafer level packaging procedure provides a wafer having a pad mounting surface with bonding pads on the pad mounting surface. An insulative layer is formed with conductor formation holes exposing the bonding pads. Conductors are formed in the respective conductor formation holes. A photoresist protective layer is formed on the pad mounting surface and then holes are formed in the photoresist protective layer for exposing parts of the respective conductors. Conductive bumps are formed in the holes in the photoresist protective layer in electric connection to the respective conductors.
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