INTEGRATED PASSIVES FOR COMMERCIAL WIRELESS APPLICATIONS

摘要

This paper discusses the modeling, design and performance of inductors and capacitors fabricated in high density interconnect (HDI), low temperature co-fired ceramic (LTCC) and silicon (Si) integrated circuit technologies. Scalable models demonstrate the capability of designing LC-based resonators and filters for use in cellular front-end modules. The performance of the circuits is presented along with size comparisons.