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A novel silicon power device with high-permittivity material for better drain voltage vs. on-resistance behavior and improved performance

机译:一种具有高介电常数材料的新型硅功率器件,具有更好的漏极电压与导通电阻性能的关系,并提高了性能

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摘要

We propose a novel vertical metal oxide semiconductor device with high permittivity (HK) trenches interleaved inside of the drift region (HKMOS). The novel structure guarantees uniform potential distribution for a wide voltage range at the blocking state owing the potential modulation effect of HK trenches, which also introduce accumulation effect to significantly reduces the specific on-resistance (Rons) of the HKMOS. Because the accumulation voltage is determined by the drain voltage because of the unique structure of the HKMOS, the device Rons will decrease with the increase of the drain voltage. As the result, indifferent from the conventional output characteristics, the drain current of HKMOS rises super-linearly instead of sub-linearly with the linear increase of the drain voltage, which is suitable for high-power applications. The simulation results indicate that the power figures of merit of HKMOS is much higher than that of the super junction device, which is orders of magnitude larger under high drain voltage condition.
机译:我们提出了一种新颖的垂直金属氧化物半导体器件,该器件具有在漂移区(HKMOS)内部交错的高介电常数(HK)沟槽。由于HK沟槽的电势调制效应,这种新颖的结构保证了在阻塞状态下宽电压范围内的均匀电势分布,这也引入了累积效应,从而大大降低了HKMOS的比导通电阻(Ron)。由于HKMOS的独特结构,累积电压由漏极电压决定,因此器件Rons将随着漏极电压的增加而减小。结果,与传统的输出特性无异,HKMOS的漏极电流随着漏极电压的线性增加而超线性而不是亚线性地增加,这适用于大功率应用。仿真结果表明,HKMOS的功率因数要比超级结器件的功率因数高得多,超级结器件在高漏极电压条件下的功率因数要大几个数量级。

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