...
首页> 外文期刊>IEEE Transactions on Electron Devices >On the Specific On-Resistance of High-Voltage and Power Devices
【24h】

On the Specific On-Resistance of High-Voltage and Power Devices

机译:高压电力设备的比导通电阻

获取原文
获取原文并翻译 | 示例
           

摘要

This paper establishes for the first time closed-form analytical limits from first-principle on the specific on-resistance, versus breakdown voltage with mobility compensation for all the currently known high-voltage device topologies: vertical DMOS, RESURF, super-junction, and thin-film silicon-on-insulator. The rigorous analytic treatment results in equations purely based on materials constants (relative dielectric constant), well-established fitting parameters (mobility, ionization coefficient), and natural constants (elementary charge, dielectric constant). The results are equally applicable to high-voltage diodes, bipolar devices and junction-FET, but the emphasis is on DMOS structures, which are the device of choice in many applications. Conduction-modulation devices (SCR, TRIAC, IGBT) are not considered here, as the inherent forward diode voltage renders those devices nonlinear at low anode-cathode voltage, making the term "on-resistance (Ron)" meaningless. The theory has been extended by many degrading mechanisms and real-life limitations and excellent agreement with reported results was obtained.
机译:本文首次针对所有当前已知的高压器件拓扑:垂直DMOS,RESURF,超结和超导,从第一原理确定了特定导通电阻与具有迁移率补偿的击穿电压之间的闭合形式分析极限。薄膜绝缘体上硅。严格的分析处理纯粹基于材料常数(相对介电常数),公认的拟合参数(迁移率,电离系数)和自然常数(元素电荷,介电常数)得出方程式。结果同样适用于高压二极管,双极型器件和结型FET,但重点是DMOS结构,它们是许多应用中的首选器件。此处不考虑使用传导调制设备(SCR,TRIAC,IGBT),因为固有的正向二极管电压使这些设备在低阳极-阴极电压下呈非线性,因此“导通电阻(Ron)”一词毫无意义。该理论已被许多降级机制和现实生活中的局限性所扩展,并与报道的结果取得了很好的一致性。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号