首页> 外文会议>2014 7th International Silicon‐Germanium Technology and Device Meeting >Revealing the high room and low temperature mobilities of 2D holes in a strained Ge quantum well heterostructures grown on a standard Si(001) substrate
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Revealing the high room and low temperature mobilities of 2D holes in a strained Ge quantum well heterostructures grown on a standard Si(001) substrate

机译:揭示在标准Si(001)衬底上生长的应变Ge量子阱异质结构中2D孔的高室温和低温迁移率

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In summary, we report an extremely high 2DHG mobility of 4500 cm2V−1s−1 and 777000 cm2V−1s−1 at 293 and 0.333 K, respectively, in a compressively strained Ge QW grown by industrial type RP-CVD on a standard Si(001) substrate. The obtained 2DHG mobility is substantially higher than those reported so far and in structures grown by research type epitaxial growth techniques, i.e. SS-MBE and LEPE-CVD. Also, the room and low temperature hole mobilities obtained are the highest not only among the group-IV Si and Ge based semiconductors, but also among p-type III–V and II–VI ones. These results demonstrate the very high quality of the strained Ge QW epilayers grown by RP-CVD and the huge potential for further applications of such materials in modern and future CMOS, p-MOSFET and p-MODFET electronic devices. The 2DHG mobility is already sufficiently high to fabricate sub-100 nm electronic devices and demonstrate ballistic transport therein at or around room temperature.
机译:总而言之,我们报告了在工业上通过RP-CVD在标准Si上生长的压缩应变Ge QW中,在293和0.333 K下分别具有4500 cm2V-1s-1和777000 cm2V-1s-1的极高2DHG迁移率( 001)基材。所获得的2DHG迁移率明显高于迄今为止报道的2DHG迁移率,并且在通过研究型外延生长技术(即SS-MBE和LEPE-CVD)生长的结构中也得到了较高的转化率。而且,获得的室温和低温空穴迁移率不仅在IV型硅和锗基半导体中最高,而且在p型III-V和II-VI型半导体中也最高。这些结果证明了通过RP-CVD生长的应变Ge QW外延层的质量非常高,并且在现代和未来的CMOS,p-MOSFET和p-MODFET电子设备中进一步应用此类材料具有巨大的潜力。 2DHG迁移率已经足够高,可以制造低于100 nm的电子设备,并在室温或室温附近表现出弹道传输。

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