首页> 外文会议>2014 7th International Silicon‐Germanium Technology and Device Meeting >Effect of thermal nitridation on phosphorus diffusion in SiGe and SiGe:C and its implication on diffusion mechanisms
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Effect of thermal nitridation on phosphorus diffusion in SiGe and SiGe:C and its implication on diffusion mechanisms

机译:热氮化对SiGe和SiGe:C中磷扩散的影响及其对扩散机理的影响

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Complementary SiGe HBTs have many advantages over an NPN only technology for numerous analog applications requiring high speed, low noise, and large voltage swing [1,2], Controlling vertical doping profile is one of the most important approaches to enhance PNP heterojunction bipolar transistor (HBT) performance. Phosphorus (P) is used in PNP HBTs as the base layer dopant. Carbon (C) in SiGe base layers has been in use to reduce P diffusion. Thermal nitridation, which injects vacancies, may be an alternative approach to retard P diffusion. This work investigated the effectiveness of thermal nitridation in retarding P diffusion in SiGe and SiGe:C. It also provides an experimental study of P diffusion mechanisms in SiGe.
机译:对于需要高速,低噪声和大电压摆幅的众多模拟应用,互补的SiGe HBT具有比仅NPN技术更大的优势[1,2],控制垂直掺杂分布是增强PNP异质结双极晶体管的最重要方法之一( HBT)性能。 PNP HBT中使用磷(P)作为基础层掺杂剂。 SiGe基层中的碳(C)已用于减少P扩散。注入空位的热氮化可能是阻止P扩散的另一种方法。这项工作研究了热氮化对阻止SiGe和SiGe:C中P扩散的有效性。它还提供了SiGe中P扩散机理的实验研究。

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