首页> 外文会议>Nano Science and Technology Institute(NSTI) Nanotechnology Conference and Trade Show(NSTI Nanotech 2006) vol.3 >Numerical Simulation of Drain-Current Transients and Current Compression in GaN MESFETs
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Numerical Simulation of Drain-Current Transients and Current Compression in GaN MESFETs

机译:GaN MESFET中漏极电流瞬态和电流压缩的数值模拟

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Transient simulations of GaN MESFETs are performed in which a three-level compensation model is adopted for a semi-insulating buffer layer, where a shallow donor, a deep donor and a deep acceptor are considered. Quasi-pulsed Ⅰ-Ⅴ curves are derived from the transient characteristics, and are compared with steady-state Ⅰ-Ⅴ curves. It is shown that so-called current compression is more pronounced when the deep-acceptor density in the buffer layer is higher and when an off-state drain voltage is higher, because trapping effects become more significant. It is suggested that to minimize current compression in GaN-based FETs, an acceptor density in a semi-insulating GaN layer should be made low.
机译:对GaN MESFET进行瞬态仿真,其中对半绝缘缓冲层采用三级补偿模型,其中考虑了浅施主,深施主和深受主。从瞬态特性导出准脉冲Ⅰ-Ⅴ曲线,并与稳态Ⅰ-Ⅴ曲线进行比较。可以看出,当缓冲层中的深受体密度较高并且截止态漏极电压较高时,所谓的电流压缩会更加明显,因为俘获效应变得更加明显。建议为使基于GaN的FET中的电流压缩最小化,应降低半绝缘GaN层中的受主密度。

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