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Simulation of surface state effects in the transient response of AlGaN/GaN HEMT and GaN MESFET devices

机译:模拟AlGaN / GaN HEMT和GaN MESFET器件的瞬态响应中的表面状态效应

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Numerical 2D transient simulations of surface trap effects in AlGaN/GaN HEMT and GaN MESFET devices have been performed. The influence of donor- and acceptor-type traps on drain current characteristics has been studied, when the gate voltage is pulsed. Opposite behaviour in the response mechanism of both devices has been found. The current collapse and related dispersion effects are due to acceptor-type traps, acting as electron traps, in MESFET devices, whereas for HEMT devices, donor-type traps, acting as hole traps, are the origin of these effects. Free hole accumulation on the top surface plays a decisive role in the behaviour of the HEMT. A detailed study about density, ionization, energy level and spatial distribution of traps reveals conclusive results in the two devices analysed.
机译:已经对AlGaN / GaN HEMT和GaN MESFET器件中的表面陷阱效应进行了数值2D瞬态仿真。当栅极电压被脉冲化时,已经研究了施主型和受主型陷阱对漏极电流特性的影响。在两个设备的响应机制中发现了相反的行为。电流崩溃和相关的色散效应是由于MESFET器件中充当电子陷阱的受主型陷阱引起的,而对于HEMT器件,充当空穴陷阱的施主型陷阱是这些效应的起源。顶表面上的自由空穴积累在HEMT的行为中起着决定性的作用。对陷阱的密度,电离,能级和空间分布的详细研究揭示了在分析的两种装置中的结论性结果。

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