首页> 外国专利> METHOD FOR MANUFACTURING SILICON SINGLE CRYSTAL SUBSTRATE, AND SILICON SINGLE CYRYSTAL SUBSTRATE

METHOD FOR MANUFACTURING SILICON SINGLE CRYSTAL SUBSTRATE, AND SILICON SINGLE CYRYSTAL SUBSTRATE

机译:硅单晶衬底的制造方法,以及硅单晶衬底

摘要

The present invention provides a method for manufacturing a silicon single crystal substrate having a carbon diffusion layer on a surface, the method comprising: a step for adhering carbon to the surface of the silicon single crystal substrate by subjecting the silicon single crystal substrate to an RTA treatment in a carbon-containing gas atmosphere; a step for reacting the carbon and the silicon single crystal substrate to form a 3C-SiC single crystal film on the surface of the silicon single crystal substrate; a step for subjecting the silicon single crystal substrate, on which the 3C-SiC single crystal film was formed, to an RTA treatment in an oxidizing atmosphere to thereby oxidize the 3C-SiC single crystal film and form an oxidized film, and inwardly diffuse the carbon into the silicon single crystal substrate; and a step for removing the oxidized film. Through this, a silicon single crystal substrate which has a proximity gettering capacity and a high level of strength in the vicinity of the surface, and for which translocation does not easily occur or extend, as well as a method for manufacturing the same, are provided.
机译:本发明提供了一种在表面上具有碳扩散层的硅单晶基板的制造方法,该方法包括:通过在含碳气体气氛中对硅单晶基板进行RTA处理,将碳粘附到硅单晶基板表面的步骤;使碳和硅单晶衬底反应以在硅单晶衬底表面上形成3C-SiC单晶膜的步骤;将形成3C-SiC单晶膜的硅单晶衬底在氧化气氛中进行RTA处理,从而氧化3C-SiC单晶膜并形成氧化膜,并将碳向内扩散到硅单晶衬底中的步骤;以及去除氧化膜的步骤。由此,提供了一种在表面附近具有邻近吸杂能力和高强度且易位不容易发生或延伸的硅单晶衬底及其制造方法。

著录项

  • 公开/公告号WO2022044641A1

    专利类型

  • 公开/公告日2022-03-03

    原文格式PDF

  • 申请/专利权人 SHIN-ETSU HANDOTAI CO. LTD.;

    申请/专利号WO2021JP27435

  • 发明设计人 QU WEIFENG;IGAWA SHIZUO;SUNAKAWA KEN;

    申请日2021-07-23

  • 分类号C30B33/02;C30B33/10;H01L21/20;H01L21/322;C30B29/06;C30B31/06;

  • 国家 JP

  • 入库时间 2022-08-24 23:45:32

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