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CHEMICAL POLISHING SOLUTION USED FOR SURFACE TREATMENT OF COPPER OR COPPER ALLOYS, AND SURFACE TREATMENT METHOD
CHEMICAL POLISHING SOLUTION USED FOR SURFACE TREATMENT OF COPPER OR COPPER ALLOYS, AND SURFACE TREATMENT METHOD
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机译:用于铜或铜合金表面处理的化学抛光溶液,以及表面处理方法
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摘要
The present invention pertains to a treatment solution for appropriately removing natural oxide films or organic substances present on the surface of copper or copper alloys. The present invention provides a chemical polishing solution used for surface treatment of copper or copper alloys, the chemical polishing solution containing, on the basis of the total amount of the chemical polishing solution, (A) 0.1-3.5 mass% of hydrogen peroxide, (B) 1-20 mass% of at least one selected from the group consisting of sulfuric acid and nitric acid, (C) 0.05-0.8 mass% of a fluoride in terms of fluorine atoms, (D) 0.01-1 mass% of at least one selected from the group consisting of anthranilic acid, cyclohexylamine, cyclohexanol, and 1,5-pentanediol, (E) 0.0005-0.005 mass% of a fluorine-based surfactant, and (F) water.
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