Study of Titanizing the Surface of Copper Substrates by the Double Glow Discharge Plasma Surface Alloying Technique

摘要

This paper discusses a study in which Ti surface alloying has been performed on copper substrates by means of a double glow discharge plasma surface alloying technique. The micro-structure, the phase structure, the micro-hardness and the distribution of Ti concentration of alloying layer were investigated in detail by XRD, SEM and so on. The effect of process parameters on the alloying layer was studied. The experimental results show that a Ti solid solution with the precipitation Cu4Ti alloying layer has been formed on the copper surface. The thickness of the alloying layer is about 120μm and the surface titanium concentration gradually decreases from w (Ti) = 87% to w (Ti) = 4%. The micro-hardness of the alloying layer is between 300 HV ～ 800 HV. Source sputtering, surface absorption, ion bombarding and high temperature diffusion are the major factors that affect the alloying layer.