首页> 外国专利> ELECTROLYTIC TIN OR TIN ALLOY PLATING BATH AND ELECTRONIC COMPONENT HAVING ELECTRODEPOSITION ARTICLE THAT IS FORMED WITH USE OF SAID PLATING BATH

ELECTROLYTIC TIN OR TIN ALLOY PLATING BATH AND ELECTRONIC COMPONENT HAVING ELECTRODEPOSITION ARTICLE THAT IS FORMED WITH USE OF SAID PLATING BATH

机译:电解锡或锡合金电镀浴和具有用所述电镀浴形成的电沉积制品的电子元件

摘要

An alkylene oxide adduct of an aliphatic monoamine or polyamine in which a plurality of oxyalkylene chains are bonded to a nitrogen atom in an amine structure in the molecule, glycerin or polyglycerin in which an oxyalkylene chain is bonded to a plurality of oxygen atoms in an alcohol structure in the molecule By forming an electrodeposit using a tin or tin alloy plating bath containing a predetermined branched polyoxyalkylene compound such as an alkylene oxide adduct of Yield can be improved.
机译:其中脂族单胺或多胺的环氧烷加合物,其中多个氧化烯链与分子的胺结构中的氮原子键合,其中氧化烯链与醇中的多个氧原子键合到多个氧原子中 通过使用含有预定支化的聚氧化烯化合物的锡或锡合金镀浴形成电沉积,可以通过含有预定的支化的聚氧化烯化合物如环的氧化烯加合物的氧化烯加合物,可以进行电沉积。

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