Method using heating of substrate manufacturing equipment and factory interface chamber

摘要

An electronic device processing device including a factory interface chamber purging device with purge gas heating. The purging device of the factory interface chamber includes one or more heating elements configured to heat the purge gas. In some embodiments, the heated purge gas can be provided to the chamber filter assembly to quickly reduce moisture contamination after the access door is opened for maintenance of the factory interface. In a further embodiment, providing a heated purge gas to the factory interface chamber facilitates desorption of certain compounds from the substrate after treatment if a low humidity environment is provided. As with many other aspects, purge control methods and devices are described. [Selection diagram] Fig. 1