首页> 外国专利> METHOD FOR TESTING ELECTRONIC EQUIPMENT TO EFFECTS OF HEAVY CHARGED PARTICLES OF OUTER SPACE BASED ON SOURCE OF FOCUSED PULSED HARD PHOTON RADIATION ON EFFECT OF REVERSE COMPTON SCATTERING

METHOD FOR TESTING ELECTRONIC EQUIPMENT TO EFFECTS OF HEAVY CHARGED PARTICLES OF OUTER SPACE BASED ON SOURCE OF FOCUSED PULSED HARD PHOTON RADIATION ON EFFECT OF REVERSE COMPTON SCATTERING

机译:基于聚焦脉冲硬膜辐射源对逆转康普顿散射的影响,测试电子设备以实现外层空间的重带粒子的影响的方法

摘要

FIELD: radio electronics. ;SUBSTANCE: the radiation resistance of electronic equipment products (EE) to the effects of heavy charged particles (HCP) is studied. The essence of the invention is that a sequential point scanning of a semiconductor crystal of an integrated circuit (IC) or a discrete semiconductor device (DSD) is carried out by pulsed hard photon (X-ray) radiation with a pulse duration of up to 5 ps, an electron energy of 8-12 keV and a photon energy in a pulse of up to 500 PJ, which, in terms of equivalent values of linear energy transfers (LET), simulates the effect of HCP on almost the entire spectrum of galactic cosmic rays and eliminates most of the critical shortcomings typical of the methods of modeling using ion accelerators, laser and synchrotron sources, identification of the regions most sensitive to single radiation effects (SRE), while a compact source of sharply focused hard photon (X-ray) radiation of picosecond duration on the effect of reverse Compton scattering is used as a source of pulsed photon radiation, containing a pulsed electron accelerator, a source of pulsed laser radiation, a collision chamber of electronic and laser pulses, focusing X-ray optics to create an optical focus of up to 10 microns in the plane of the instrument layer of the semiconductor crystal of the IC or DSD. ;EFFECT: providing the possibility of modeling single radiation effects that occur when exposed to HCP in semiconductor IC and DPP crystals in a wide range of linear energy transfers (LET) without the use of expensive ion accelerators and synchrotron radiation sources. ;1 cl, 1 dwg
机译:现场:无线电电子产品。 ;物质:研究了电子设备产品(EE)对重带电粒子(HCP)的影响的辐射阻力。本发明的本质是通过脉冲硬光子(X射线)辐射来执行集成电路(IC)或离散半导体器件(DSD)的半导体晶体的顺序点扫描,其脉冲持续时间5 PS,电能为8-12keV和光子能量,脉冲高达500 pj,就线性能量转移的等效值(Let)而言,模拟了HCP几乎整个频谱的效果银河系宇宙射线,消除了使用离子加速器,激光和同步速度的建模方法,鉴定对单辐射效应最敏感的地区(SRE)的鉴定,而急剧聚焦的坚硬光子的紧凑源(x - ray)辐射在反向康普顿散射的效果上的辐射用作脉冲光子辐射的源,含有脉冲电子加速器,脉冲激光辐射的源,碰撞腔ONIC和激光脉冲,聚焦X射线光学器件,在IC或DSD的半导体晶体的仪表层的平面中产生高达10微米的光学焦点。 ;效果:提供在广泛的线性能量转移(假设)中暴露于半导体IC和DPP晶体中暴露于HCP时发生的单辐射效应的可能性,而不使用昂贵的离子促进剂和同步辐射源。 ; 1 cl,1 dwg

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