首页> 外国专利> TECHNIQUES FOR DETERMINING AND CORRECTING FOR EXPECTED DOSE VARIATION DURING IMPLANTATION OF PHOTORESIST-COATED SUBSTRATES

TECHNIQUES FOR DETERMINING AND CORRECTING FOR EXPECTED DOSE VARIATION DURING IMPLANTATION OF PHOTORESIST-COATED SUBSTRATES

机译:用于测定和校正光致抗蚀剂涂覆基材的预期剂量变化的技术

摘要

A method, including using an implant recipe to perform an implant by scanning an ion beam along a first axis over a substrate, coated with a photoresist layer, while the substrate is scanned along a perpendicular axis; measuring an implant current (I) during the implant, using a first detector, positioned to a side of a substrate position; determining a value of a difference ratio (I−B)/(B), based upon the implant current, where B is current measured by the first detector, during a calibration at base pressure; determining a plurality of values of a current ratio (CR) for the plurality of instances, based upon the difference ratio, the current ratio being a ratio of the implant current to a current measured by a second detector, positioned over the substrate position, during the calibration; and adjusting scanning the ion beam, scanning of the substrate, or a combination thereof, based upon the current ratio.
机译:一种方法,包括使用植入物配方通过沿着涂覆有光致抗蚀剂层的第一轴扫描离子束来执行植入物,同时沿着垂直轴扫描基板;使用第一检测器在植入物期间测量植入物电流(I),该第一检测器位于基板位置的一侧;基于植入物电流确定差值(I-B)/(b)的值,其中B是由第一检测器测量的电流,在基础压力下校准期间;基于差值,确定多个实例的电流比(CR)的多个值,电流比是植入物电流与由第二检测器测量的电流的比率,位于基板位置期间校准;并根据电流比调节扫描离子束,扫描基板或其组合。

著录项

  • 公开/公告号US2021175048A1

    专利类型

  • 公开/公告日2021-06-10

    原文格式PDF

  • 申请/专利权人 APPLIED MATERIALS INC.;

    申请/专利号US202017093468

  • 发明设计人 ERIC DONALD WILSON;GEORGE GAMMEL;

    申请日2020-11-09

  • 分类号H01J37/317;H01J37/256;H01J37/244;H01J37/304;

  • 国家 US

  • 入库时间 2022-08-24 19:07:19

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