首页> 外国专利> A sintered body composed of a copper-based alloy powder for powder metallurgy and the copper-based alloy powder.

A sintered body composed of a copper-based alloy powder for powder metallurgy and the copper-based alloy powder.

机译:由用于粉末冶金和铜基合金粉末的铜基合金粉末组成的烧结体。

摘要

To provide a copper-based alloy powder for powder metallurgy capable of forming a green compact less causing a damage such as corner breakage and excellent in handling ability even if forming a small-sized component or a component shaped complicated, so that a sintered body formed by sintering the copper-based alloy powder is suitably usable in manufacturing a copper-based sintered component because of providing a sintered body having a high matrix strength and a high electrical conductivity and heat dissipation.SOLUTION: A copper-based alloy powder for powder metallurgy contains 0.05-1.6% by weight of Fe, 0.01-0.3% by weight of P and the remainder of Cu and inevitable impurities. The alloy powder has an apparent density of 4.0 g/cmor lower and a particle size distribution of 70% or more falling under 106 μm or smaller.SELECTED DRAWING: None
机译:提供一种用于粉末冶金的铜基合金粉末,其能够形成较低的绿色紧凑,导致诸如角裂缝的损坏以及操作能力优异,即使形成小尺寸的部件或成形复杂,也可以形成烧结体通过烧结铜基合金粉末在制造铜基烧结组分方面适当可用于,因为提供具有高矩阵强度和高导电性和散热和散热性的烧结体:溶液:粉末冶金的铜基合金粉末含有0.05-1.6重量%的Fe,0.01-0.3%重量的P和剩余的Cu和不可避免的杂质。合金粉末的表观密度为4.0g / cmor,粒度分布为70%或更多次落下106μm或更小。选择:无

著录项

  • 公开/公告号JP6860435B2

    专利类型

  • 公开/公告日2021-04-14

    原文格式PDF

  • 申请/专利权人 福田金属箔粉工業株式会社;

    申请/专利号JP20170127072

  • 发明设计人 木越 悠太;宮川 智;

    申请日2017-06-29

  • 分类号B22F1;C22C9;B22F9/08;C22C1/04;B22F3/24;C22F1/08;C22F1;

  • 国家 JP

  • 入库时间 2022-08-24 18:11:45

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