LEAD FRAME, PACKAGED INTEGRATED CIRCUIT BOARD, POWER CHIP, AND CIRCUIT BOARD PACKAGING METHOD

摘要

The present application provides packaging solutions including a lead frame applicable to circuit board packaging, a packaged integrated circuit board, a power chip, and a circuit board packaging method, which can enhance the safety and reliability of packaged circuit boards. The lead frame comprises a plurality of frame units arranged side by side in a first direction. Each frame unit comprises a hollow side frame, and a plurality of pins and a connection rib disposed within the side frame. Each pin comprises a first pin portion and a second pin portion integrally formed and extending in a second direction. The first pin portion is disposed within the side frame, and is electrically connected to a circuit board, and the second pin portion is fixedly connected to the side frame. The second direction is perpendicular to the first direction. The connection rib is connected between the plurality of pins and the side frame.