A family of ductile, non-aggressive, low temperature brazing alloys, particularly suitable for brazing and diffusion-welding aluminum alloys, titanium alloys, beryllium alloys, boron-borsic-graphite composite structures to such alloys, diamond bonding and dissimilar metal joints of aluminum, titanium or steels. The family of aluminum base brazing alloys include, by weight, 0.1 to 5% magnesium, 0.1 to 5% rare earth, 4 to 15% silicon and an addition of 1 to 9% tin, 0.3 to 5% copper, 2 to 10% palladium, 1 to 6% gallium, 1 to 8% silver or 0.1 to 0.25% bismuth or strontium, with the balance aluminum. Where the addition is palladium, the silicon content may be 0 to 12%.
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