首页> 外国专利> Joining two parts via preformed solder ring - where one part is provided with convex projection so high quality joint is obtd.

Joining two parts via preformed solder ring - where one part is provided with convex projection so high quality joint is obtd.

机译:通过预成型的焊环将两部分连接起来-其中的一部分设有凸出的凸起,因此可以实现高质量的接头。

摘要

One part consists of a carrier (10), which is provided with a convex projection on its joint surface. The second part (12), which is e.g. a wire with a head, is placed on the projection; and the joint is surrounded by a solder ring(13). The assembly (10,12,13) is then heated to melt the solder (13), which wets both parts (10,12) to make the joint. When the solder ring (13) melts, the non-metallic inclusions and flux residues remain outside the joint so a clean bond free from piping and segregation is obtd. The result is a much better bond than when a solder foil is used. Copper wire (12) has head (12a), with joint surface (12b) placed on a convex projection (11) in a copper sheet carrier (10). A soft solder ring (13) is placed round the joint, followed by heating in a controlled atmos. to make bond (13a).
机译:一部分由载体(10)组成,该载体在其接合表面上设有凸出的凸起。第二部分(12),例如将带有头部的电线放置在突起上。接头被焊环(13)包围。然后加热组件(10、12、13)以熔化焊料(13),焊料将两个零件(10、12)弄湿以形成接头。当焊环(13)熔化时,非金属夹杂物和助焊剂残留物会留在接头外部,因此会形成干净的粘结,没有管道和偏析。结果是与使用焊料箔时相比,粘合性好得多。铜线(12)具有头部(12a),其连接表面(12b)置于铜片载体(10)中的凸出凸起(11)上。将软焊环(13)放在接缝周围,然后在受控的氛围中加热。进行粘结(13a)。

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