GOLD PLATING LIQUID AND GOLD PLATING METHOD FOR USING GOLD PLATING LIQUID

摘要

PURPOSE:To form a metal plating layer presenting golden semi-luster, by carrying out plating on the substrate by using gold plating liquid containing gold cyanide complex ion, conductive salt and a fixed amount of rare earth elements or moreover, using a fixed pulse electric current. CONSTITUTION:In case of carrying out gold plating of semiconductor parts substrate, etc., such as transistor header, etc., pure gold deposit having uniform golden semi-luster and contenting desirable gold plating characteristics, is formed by using gold plating liquid containing gold cyanide complex salt, such as gold cyanide potassium and moreover, containing conductive salt such as acetic acid, etc. and 1-200g/l of rare earth elements such as cerium sulphate, etc. or using the above plating liquid and also carrying out gold plating by using pulse wavy direct current having a period of 100-10,000Hz and ON and OFF time being the ratio of ON and OFF time 1:1-1:10.