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ELECTROLESS GOLD PLATING LIQUID REPREPARATION METHOD, ELECTROLESS GOLD PLATING METHOD AND GOLD ION-CONTAINING LIQUID

机译:化学镀金液的再制备方法,化学镀金法和含金离子的液

摘要

PROBLEM TO BE SOLVED: To provide an electroless gold plating repreparation method where, in the case plating is applied using an electroless gold plating liquid with a gold sulfite salt as a gold ion source, the liquid stability of the electroless gold plating liquid can be sufficiently maintained, and also, gold ions can be sufficiently effectively fed to the electroless gold plating liquid without waste.;SOLUTION: The electroless gold plating repreparation method comprises a stage where a gold ion-containing liquid obtained by mixing an alkaline aqueous solution comprising a gold sulfite salt with a pH regulation liquid comprising a sulfite other than a gold sulfite salt and hydrochloric acid or sulfuric acid is added to an electroless gold plating liquid comprising a gold sulfite salt in such a manner that the concentration of the gold ions in the electroless gold plating liquid is held to a prescribed range.;COPYRIGHT: (C)2007,JPO&INPIT
机译:解决的问题:提供一种化学镀金的再制备方法,其中在使用以亚硫酸金盐作为金离子源的化学镀金液进行镀覆的情况下,化学镀金液的液体稳定性可以足够。维持;并且,可以将金离子充分有效地送入化学镀金液而不会浪费。;解决方案:化学镀金的重新制备方法包括一个阶段,在该阶段中,通过混合包含金的碱性水溶液而获得含金离子的液体将具有亚硫酸盐而不是亚硫酸盐的pH调节液的亚硫酸盐和盐酸或硫酸以使得化学镀金中金离子的浓度的方式添加到包含亚硫酸金盐的化学镀金液中。镀液保持在规定范围内。版权所有:(C)2007,日本特许厅

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