DIE BONDING DEVICE FOR SEMICONDUCTOR PELLET

摘要

PURPOSE:To omit a minute reciprocating mechanism installed to a carriage, and to simplify and miniaturize structure by forming an irregular section reciprocating the carriage only by minute distance to the stop section of a cam. CONSTITUTION:A plurality of irregular sections 15 in minute height (h) are shaped to the stop section 9a of a plate cam 9. When a collet head 3 is moved up to the upper section of a lead frame 2 with the revolution of the plate cam 9 under the state in which the collet head 3 sucks a semiconductor pellet 4, the state in which the collet head 3 is stopped by the stop section 9a is brought. The collet head 3 is lowered under the state, the pellet 4 is pushed against the lead frame 2, a ring piece 11 at the base end of a lever 10 is brought into contact with the irregular sections 15 with the revolution of the plate cam 9, the lever 10 is rocked and turned, and the collet head 3 is given a scrubbing motion reciprocating only by minute width. The pellet 4 is die-bonded with the lead frame 2. Accordinglly, mechanism for the scrubbing motion can be omitted, and a carriage 7 to which the collet head 3 is mounted is lightened, thus increasing the speed of die bonding.