METHOD FOR OPTIMIZING MEASUREMENT CONDITIONS OF OVERLAPPING ACCURACY MEASURING DEVICE AND METHOD FOR OPTIMIZING ALIGNMENT MARK SHAPE OR ALIGNMENT MARK MEASUREMENT SYSTEM IN EXPOSURE DEVICE

摘要

PURPOSE:To optimize measurement conditions by obtaining the fluctuation of the difference in the amount of deviation for each center measurement mark of a peripheral measurement mark according to the combination of a plurality of center measurement marks and a plurality of peripheral marks. CONSTITUTION:A pattern 10 for measuring deviation consists of a center measurement mark 12 and a plurality of peripheral measurement marks 14 laid out at the periphery of the center measurement mark 12 and a plurality of patterns 10 are formed on a substrate. A pattern 20 for measuring the deviation consists of a center measurement mark 22 and a plurality of peripheral measurement marks 24 laid out at the periphery of the mark 22 and then a plurality of patterns 20 are formed on the substrate so that the mark 22 is formed nearly at a center part and a plurality of marks 24 are formed nearly at the center part of a plurality of marks 14. Then, the amount of deviation between the marks 12 and 22 is measured by an alignment accuracy measuring device and the amount of deviation between the marks 14 and 24 is measured, thus optimizing measurement conditions.