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PLASMA CVD DEVICE AND CVD PROCESSING METHOD EMPLOYING THE DEVICE AND CLEANING METHOD FOR INSIDE OF THE DEVICE
PLASMA CVD DEVICE AND CVD PROCESSING METHOD EMPLOYING THE DEVICE AND CLEANING METHOD FOR INSIDE OF THE DEVICE
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机译:等离子体化学汽相淀积装置及采用该装置的化学汽相淀积方法及装置内部的清洗方法
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摘要
PURPOSE: To provide a CVD process device which has a plasma generating means constituted by an ICP, and allow a condition for forming a film to be observed from the outside. ;CONSTITUTION: CDV process gas is introduced into a vacuum container 4 out of a process gas introducing port 6, and when high frequency electric power is applied to an antenna 3b provided in the vicinity of a dielectrics window 2, a high frequency electric field is induced within the vacuum container 4 by means of electromagnetic waves from the antenna 3b, and CVD process gas is formed into plasma, so that a film is formed over a specimen 9 by the accumulating of decomposition products. The antenna 3b, the dielectrics window 2 and a specimen stand 8 are set over the same shaft of the vacuum container 4 while being aligned in a plane direction, and the antenna 3b and the dielectrics window 2 are made larger in diameter than the specimen 6, so that the film is thereby uniformly formed. Besides, since the dielectrics window 2 is made of transparent material, a proceeding condition for forming the film can be observed from the outside, the film thickness can thereby be measured and controlled by a film thickness measuring means.;COPYRIGHT: (C)1995,JPO
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