A method for the production of adhesive bonds for electronics - and electronics applications

摘要

The invention relates to a process for temperature-controlled laser bonding, for example chip bonding and die bonding with hot-melt adhesives, in which the semiconductor chips before individual separation, i.e the wafer, is thinly coated with resistant hot-melt adhesive which is hard at room temperature, the individual chips are positioned with an automatic component mounting installation (epoxy die bonder) and in the following cycle are bonded "on-line" with a temperature-controlled Nd:YAG laser via glass fibre cables. Furthermore, the quick bonding or curing of large-area lightweight structures by means of laser spot bonding or seam bonding is described. The process is explained with reference to exemplary embodiments and its advantageousness is demonstrated by diagrams in the drawing.