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A magazine for holding a disk-shaped processed product in a liquid bath in a wet surface treatment, and a wet surface treatment method for a disk-shaped processed product in a liquid bath using the magazine
A magazine for holding a disk-shaped processed product in a liquid bath in a wet surface treatment, and a wet surface treatment method for a disk-shaped processed product in a liquid bath using the magazine
A container is provided which is intended, in particular, for etching semiconductor wafers in a liquid bath and which contains an insert (5) having 1.1-1.9-times the diameter of a wafer (6). The insert comprises arrangements of bundles of guide bars (12) held in parallel and spaced apart at a distance of at least twice the wafer thickness by spacing bars (8). The bundles (12) of guide bars comprise main guide bars (9) and subsidiary guide bars (10) which diverge in not more than three directions at linkage points (13) which are not situated on the axis of the housing. …??This etching container makes it possible to reduce the impairment of the wafer geometry normally observed in etching treatments considerably.
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