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METHOD OF CONTROLLING OXIDE THINNING IN AN EPROM OR FLASH MEMORY ARRAY

机译:控制EPROM或闪存阵列中氧化物变薄的方法

摘要

A method of fabricating an electrically-programmable read-only- memory (EPROM) or a flash memory array structure that controls oxide thinning to prevent shorts in the array and trenching of the bit lines is provided. The method includes the following steps. First, in accordance with conventional processing techniques, layers of gate oxide, polyl, ONO, poly cap, and nitride are sequentially deposited on the substrate. Next, in accordance with the present invention, a layer of thin poly is deposited on the layer of nitride. The thin poly/nitride/poly cap/ONO/polyl layers are then etched to define thin poly/nitride/poly cap/ONO/polyl parallel strips. Edge oxide is then formed on the thin poly/nitride/poly cap/ONO/polyl strips. Following this, a layer of spacer oxide is formed over the layer of edge oxide. An anisotropic etch back of the layers of spacer oxide and edge oxide is then performed until the thin poly layer and the substrate are exposed. Next, a N-type dopant is introduced into the substrate material between the thin poly/nitride/poly cap/ONO/polyl strips to define the N+ buried bit lines of the array. Optionally, a thin layer of edge oxide can be formed over the substrate prior to the introduction of the dopant. Following the formation of the buried bit lines, a layer of differential oxide is grown over the above- described structure and the process then continues according to conventional steps.
机译:提供一种制造电可编程只读存储器(EPROM)或闪存阵列结构的方法,该方法控制氧化物减薄以防止阵列中的短路和位线的沟槽化。该方法包括以下步骤。首先,根据常规的处理技术,在衬底上依次沉积栅氧化层,多晶硅层,ONO层,多晶硅盖层和氮化物层。接下来,根据本发明,在氮化物层上沉积一层薄的多晶硅。然后蚀刻薄的聚/氮化物/聚帽/ ONO /多晶层,以限定出薄的聚/氮化物/聚帽/ ONO /多晶平行条。然后,在薄的聚/氮化物/聚帽/ ONO /聚l带上形成边缘氧化物。之后,在边缘氧化物层上形成间隔氧化物层。然后对间隔氧化物和边缘氧化物的层进行各向异性回蚀,直到暴露出薄的多晶硅层和衬底。接下来,将N型掺杂剂引入到薄的多晶硅/氮化物/多晶硅盖/ ONO /多晶硅条之间的衬底材料中,以限定阵列的N +掩埋位线。可选地,可以在引入掺杂剂之前在衬底上方形成边缘氧化物薄层。在形成掩埋位线之后,在上述结构上方生长差分氧化物层,然后根据常规步骤继续该过程。

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