Inspection device for back-and-auto inspection system for BGA semiconductor package

摘要

The present invention relates to an inspection apparatus of a back-and-auto inspection system for a BGA semiconductor package, in which a PCB 90 to which a solder ball 91 is fused during a manufacturing process of a BGA semiconductor package is removed from a deflux apparatus 20 And an inspection device (40) for inspecting the presence or absence of the solder ball (91), the position and the ball size, and the like,;A floor part 40C for guiding the PCB 90 in the lateral direction on the table T of the inspection device 40;;A rail (41) for allowing the PCB (90) to be moved and moved to the floor part (40C);;A conveyance port 42 for conveying the PCB 90 placed on the rail 41;;A lead screw 44 for moving the feed opening 42 in the left-right direction;;A motor 43 for rotating the lead screw 44;;Thereby improving the inspection workability of the PCB and increasing the reliability of the inspection.