PROBING WITH BACKSIDE EMISSION MICROSCOPY

摘要

A method and apparatus for probing with backside emission microscopy for locating defect sites in an integrated circuit specimen, where a first microscope (23) positioned for observing the front side of the specimen and a second microscope (11) positioned for observing the backside of the specimen. A carrier (16) is provided for supporting the specimen in a plane perpendicular to the plane of the first and second microscopes. A white light camera (24) is mounted on the first microscope for acquiring an illiminated image of the front side of the specimen, and generates its image as corresponding to side indicia of the backside of the specimen. A light emission sensitive camera (12) mounted on the second microscope acquires a light emission image of the backside of the specimen in response to electrical test signals applied at terminals of the specimen by test probes. The light emission sensitive camera generates the emission image for superposing with the illuminated image to identify the location of defect sites in the specimen. In a described embodiment, the microscopes are rotatable between vertical and horizontal orientations, wherein the specimen is supported in a vertical plane for backside emission microscopy. Backside supports, e.g., a pair of supports, are positionned at the backside of the specimen leaving an area of interest exposed for observation with said second microscope.